Viscom
iX7059 Heavy Duty Inspection – fast inline inspection with maximum precision
iX7059 Heavy Duty Inspection – fast inline inspection with maximum precision
Large, heavy, and solid assemblies – whether encased or as complete models – require 100% quality assurance, depending on the area of application. As a result, perfect-fit inline X-ray inspection in 2D, 2.5D, or 3D is the first choice for high current and high voltage electronics. This is because inspected components and flawless solder joints are the only way to guarantee the necessary functional reliability in cases where, for example, critical solder joints that have air inclusions of an excessive number or size could jeopardize heat dissipation in power electronics and lead to overheating. With its iX7059 product line, Viscom is setting a new standard for fast, high-precision inline X-ray inspection. The special transport system enables seamless handling of inspection objects on workpiece carriers or in soldering frames with a weight of up to 40 kg – a unique feature that offers huge advantages for trending segments such as e-mobility, new energies, and telecommunications.
Highlights
Highlights
• Reliable inspection for heavy, solid, and encased components
• Powerful X-rays with 130 kV or optionally 160 kV
• One-of-a-kind transport concept for fast handling of workpiece carriers and soldering frames
• High-precision inspection in 2D, 2.5D, and 3D
• Fast inspection program creation thanks to 3D analysis and an IPC-compliant AXI inspection library
• Maximum inspection program optimization through integrated verification
• Additional vertical slices for optimum analyses and dependable verification
• High-quality 3D AXI volume calculation with planar CT
Connectivity
Connectivity
• Global libraries, global calibration: transferability to all systems
• Automated grayscale value calibration for consistent inspection results
• Traceability, statistical process control, offline programming, multiline verification
• Viscom Quality Uplink: effective networking and process optimization
• Interfaces: SMEMA, IPC Hermes Standard (optional)
Inspection
Inspection
Scope of inspection: Air inclusions/blow holes (voids) in surface soldering, presence, offset, excessive/insufficient solder, solder bridge, solder balls, solder sputter, soldering defects, THT fill level and pin height, nonwetting, contamination, damaged component, missing or incorrect component, imperfect shape, tombstoning, lifted lead, billboarding, supine, twist, wick-up effect (optional)
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