iS6059 THT Inspection – unmatched 3D AOI for underside quality control

• Maximum performance: Featuring a powerful 3D XM sensor system concept for performing quality inspections from below
• First-rate inspection quality: Shadow-free inspection thanks to 8 angled cameras
System flexibility: reliable handling of a wide range of different inspection objects
• Optimum process design due to extended handling possibilities such as long board option
• Minimal time and training requirements thanks to Viscom standard software
• Flexible integration into existing productions
• Improved ergonomic design

• Global libraries, global calibration: Transferability to all systems
• Outstanding inspection program optimization thanks to flexible single and multiline verification solutions
Simple operation and inspection program generation with • EasyPro/vVision
• High-performance OCR software
• Connection via horizontal interfaces along the production line
• Viscom Quality Uplink: intelligent networking of Viscom • inspection systems along the production line
• Production line control and product traceability
• Flexible integration of additional production-relevant modules: buffers, label printers, etc.
• Connection to vertical interfaces for communication with MES systems
• Statistical process control with Viscom SPC/vSPC
• Offline programming stations for increased efficiency
• Optional connection to the digital multi-purpose platform vConnect

Components: THT, press-fit and SMD

Solder joints: 3D inspection of PCB bottom sides after wave soldering or selective soldering

Defects/characteristics:
SMD: Presence, XY position, rotation, component height, polarity, missing solder, soldering defects, lifted heads/tombstoning, bridging

THT: Presence, XY position, missing solder, soldering defects, bridging, pin height, non-wetting on pins, non-wetting on pads

Optional: Free area analysis, wobble circle error, color ring analysis, OCR, blow holes in the solder joint, solder ball/solder sputter