iS6059 PCB Inspection – first-class inspection results for efficient SMT manufacturing

• Robust system design
• Ideal system configuration with respect to costs/benefits
• High inspection speed
• One orthogonal camera and eight angled-view cameras provide virtually shadow-free 3D inspections
• Verified zero defect slippage thanks to integrated verification
• Flexible integration into existing productions
• Improved ergonomic design

• Global libraries, global calibration: transferability to all systems
• Intelligent software add-ons such as integrated verification or Viscom Quality Uplink for effective networking
• Traceability, offline programming, statistical process control
• Communication with MES systems
• Independent real-time image processing with Viscom analysis tools
• High-performance OCR software
optional connection to the digital multi-purpose platform vConnect

Components: up to 03015 and fine-pitch components

Solder paste, solder joint and assembly control

Defects/defect features: excessive/insufficient solder, missing solder/solder skip, component missing, component offset, wrong component, component damaged, component overpopulated, billboarding, component on back, damaged pin, bent pin, solder bridging/short circuit, tombstoning, lifted lead, soldering defects, nonwetting, contamination, polarity error, rotation, imperfect shape

Optional: free area analysis, color ring analysis, wobble circle error, OCR, blow holes in the solder joint, solder ball/solder sputter