Viscom
X7056-II – An Innovative Inline X-ray system
X7056-II – An Innovative Inline X-ray system
The X7056-II's state-of-the-art X-ray technology ensures precise inspection of high-end electronics. The inline X-ray system has won five international awards for its extremely high throughput and outstanding image quality. Even concealed solder joints and components are displayed as crystal-clear slice images to guarantee seamless quality control. The option to also integrate AOI inspection within the system and to perform combined inspections is a special feature of the X7056-II – an efficient, space-saving highlight that provides fast and comprehensive inspection results.
Highlights
Highlights
• System can be used as a 3D AXI system or combined 3D AXI / 3D AOI
• Revolutionary xFastFlow handling concept for changing printed circuit boards in as little as 4 seconds
• Ultra-thorough inspection of single or double-sided electronic assemblies
• Three different flat panel detector sizes for scalable throughput
• Fast inspection program creation thanks to 3D analysis and an IPC-compliant AXI inspection library
• Maximum inspection program optimization through integrated verification
• Additional vertical slices for optimum analyses and dependable verification
• High-quality 3D AXI volume calculation with planar CT
Connectivity
Connectivity
• Global libraries, global calibration: Transferability to all systems
• Automated grayscale value calibration for consistent inspection results
• Traceability, statistical process control, offline programming, multiline verification
• Viscom Quality Uplink: Effective networking and process optimization
Optional:
• Freely configurable interfaces for connecting various modules
• Control of label printers, bad-board markers and FIFO buffers
• Communication with MES systems
• Support for M2M communication standards such as SMEMA, IPC-CFX,
• The Hermes Standard, and JARAS 1014
Inspection
Inspection
Components: BGA up to 0.3 mm pitch, QFN, DFN, LGA, THT/THR, LEDs
Solder joints: Visible and concealed solder joints
Defects/Features: Air inclusions/blow holes in solder joints (voids), presence, misalignment, excessive/insufficient solder, bridging, solder balls, solder sputter (optional), soldering defects, nonwetting, contamination, damaged component, missing or incorrect component, imperfect shape, tombstoning, lifted leads, billboarding, face down, rotation, polarity, solder wicking (optional), head-in-pillow (balls), THT filling degree and pin height
Combined AOI/AXI: character recognition, color recognition, barcode recognition, OCR (optional), analysis of free surfaces (optional)
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