Viscom
iS6059 Dual Lane Variants – High-Speed System for Dual-Track Production
iS6059 Dual Lane Variants – High-Speed System for Dual-Track Production
The iS6059 Dual Lane Variants Inspection combines the advantages of special high-speed 3D sensor technology with excellent inspection quality and extremely fast inspection speed. The 3D AOI system, which was developed for the economical large-scale production of assemblies, reliably inspects both components and solder joints. Within the manufacturing process, it can be intelligently networked for Industry 4.0 applications.
Highlights
Highlights
• Inspection on two lanes at the same time
• Any options you would get with the single lane equivalents are available here, as well
• Robust system design
• Verified zero defect slippage thanks to integrated verification
• Flexible integration into existing productions
• Improved ergonomic design
Connectivity
Connectivity
• Global libraries, global calibration: transferability to all systems
• Intelligent software add-ons such as integrated verification or Viscom Quality Uplink for effective networking
• Traceability, offline programming, statistical process control
• Communication with MES systems
• Independent real-time image processing with Viscom analysis tools
• High-performance OCR software
optional connection to the digital multi-purpose platform vConnect
Inspection
Inspection
Components: up to 03015 and fine-pitch components
Solder paste, solder joint and assembly control
Defects/defect features: excessive/insufficient solder, missing solder/solder skip, component missing, component offset, wrong component, component damaged, component overpopulated, billboarding, component on back, damaged pin, bent pin, solder bridging/short circuit, tombstoning, lifted lead, soldering defects, nonwetting, contamination, polarity error, rotation, imperfect shape
Optional: free area analysis, color ring analysis, wobble circle error, OCR, blow holes in the solder joint, solder ball/solder sputter
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