Viscom
iS6052 AOI – reliable inspection results for efficient SMT manufacturing
iS6052 AOI – reliable inspection results for efficient SMT manufacturing
Introducing the iS6052 AOI, the latest addition to Viscom's esteemed lineup of AOI systems. This new system optimized for mass-production offers a compelling option for manufacturers looking to enhance their PCB inspection processes without breaking the bank.
Built upon the foundation of advanced high-speed camera technology, the iS6052 AOI maintains the hallmark traits of excellent inspection quality and rapid inspection speeds. Tailored for cost-effective large-scale production of assemblies, it provides reliable inspection capabilities for both components and solder joints.
What sets the iS6052 AOI apart is its affordability without compromising performance or reliability. Despite its optimized performance, it upholds Viscom's commitment to quality and precision. Furthermore, its seamless integration into manufacturing processes allows for intelligent networking options, empowering Industry 4.0 applications for enhanced data exchange and real-time monitoring.
Whether as a standalone solution or as part of a comprehensive AOI strategy, the iS6052 AOI offers manufacturers a versatile tool to optimize PCB inspection processes while keeping highest quality standards. With its blend of affordability, quality, and efficiency, it represents a valuable addition to Viscom's lineup, catering to a wide range of production environments and needs.
Highlights
Highlights
• Robust system design
• Ideal system configuration with respect to costs/benefits
• High inspection speed
• One orthogonal camera and four angled-view cameras provide basically shadow-free 3D inspections
• Verified zero defect slippage thanks to integrated verification
• Flexible integration into existing productions
• Improved ergonomic design
Connectivity
Connectivity
• Global libraries, global calibration: transferability to all systems
• Intelligent software add-ons such as integrated verification or Viscom Quality Uplink for effective networking
• Traceability, offline programming, statistical process control
• Communication with MES systems
• Independent real-time image processing with Viscom analysis tools
• High-performance OCR software
optional connection to the digital multi-purpose platform vConnect
Inspection
Inspection
Components: up to 03015 and fine-pitch components
Solder paste, solder joint and assembly control
Defects/defect features: excessive/insufficient solder, missing solder/solder skip, component missing, component offset, wrong component, component damaged, component overpopulated, billboarding, component on back, damaged pin, bent pin, solder bridging/short circuit, tombstoning, lifted lead, soldering defects, nonwetting, contamination, polarity error, rotation, imperfect shape
Optional: free area analysis, color ring analysis, wobble circle error, OCR, blow holes in the solder joint, solder ball/solder sputter
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